WebFC-BGA substrates are semiconductor packages with fine design rule and high reliability. Kyocera provides IC packages with more than 3,000 I/Os, and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology. Features Leaders-in circuitization rule as line/space: 9µm/12µm WebDec 20, 2024 · The CSP package has the following characteristics: Answer: CSP is only smaller in size, smaller than CSP is called FC (Flip Chip). Flip Chip is called flip chip in our SMT assembly, which is to solder the bare chip directly to the PCB. BGA is very wide, CSP is just one of them, Just a small package Generally less than 1: 1.2 different pitch

FC-CSP Substrates Organic Package KYOCERA

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