WebPolyimide based Temporary Wafer Bonding Technology for High Temperature Compliant TSV Backside Processing and Thin Device Handling K. Zoschke 1, T. Fischer , M. Töpper … WebThe single crystalline thin film of Ge was transferred on the polyimide by adhesive wafer bonding and smart-cut techniques. A simple tunneling metal-oxide-semiconductor structure is fabricated for the detector applications. Due to the transparency of the polyimide, the responsivity of the detector is sensitive to the environments.
Polyimide based Temporary Wafer Bonding Technology for
WebMethods for attaching the wafer scale semiconductor chip, up to 4 square inch (2.times.2 inchs), are comprises of following steps. Stack assembles following materials from bottom to top. First lower integrated heat spreader (IHS). Second thermal interface material (TIM). Third semiconductor chip with backside metallization deposit. Forth polyimide film. Fifth … WebTemporary wafer bonding for thin wafer pro-cessing is one of the key technologies of 3D system integration. In this context we introduce the polyimide material HD3007 which is suitable for temporary bonding of silicon wafers to carrier wafers by using a thermo compression process. Coating and bonding processes for 200 mm and charles ochello new orleans
Polyimide - definition of polyimide by The Free Dictionary
WebIn this study we succeeded in easy bonding and debonding PI films on glass wafers directly by using Si or Cu intermediate layer with Fe ultra-thin layer at room temperature. The Si or Cu layer was deposited on polyimide films and glass wafers by Ar ion beam sputtering, and then film and wafer ware brought into contact and pressed in high vacuum. WebLow-temperature polyimide (PI) and non-conductive paste (NCP) were used to conduct two kinds of processes of hybrid bonding. If PI was coated and partially cured on a patterned wafer before CMP, co-planarization of nt-Cu/PI should be done afterwards to fabricate Cu/PI structure. The Cu/PI hybrid bonding can be achieved at 200 °C for 30 min. WebDownload Table The material properties of parylene, BCB and polyimide. from publication: Wafer bonding using microwave heating of parylene intermediate layers This paper … harry printers east london